ZEISS at IPFA

Greg Johnson brings his popular Tutorial on semiconductor defect localization mechanisms to IPFA 2023. After receiving a BS from Virginia Tech and doing some graduate research at the University of Florida, Greg joined IBM East Fishkill. For ten years, he worked in the Packaging Development Laboratory, where he applied his failure analysis, materials, and powder characterization skills to solving manufacturing problems and developing new formulations in greensheet and paste. He was ultimately named an inventor on 19 U.S. Patents. Then Greg moved to the Semiconductor Research and Development Center, where he was either the sole or lead failure analysis engineer for FEOL defect localization across eight bulk technology node qualifications, and one in SOI technology. During this time, we was active in failure analysis technique development in optical and electrical techniques such as multi-photon OBIC and EBIRCH. At ZEISS Microscopy, he is now engaged in application development for electron microscopy in the Electronics group. He has now published widely on AFM, ion beam microscopy, nanoprobing EBIC, and EBIRCH for semiconductor applications, as well given tutorials to a number of scientific conferences. He's also been session chairs for Tutorials, User Groups, and in the technical program at ISTFA.

Dr Allen Gu joined ZEISS Microscopy (formerly Xradia) in 2010. He leads X-ray application development and strategic marketing for ZEISS global electronics market. His expertise is in 3D X-ray tomographic imaging and analysis for failure analysis, quality control and reliability in the electronics industry. Before his career in ZEISS, he served for many years as Sr. applications scientist/microscopist for several San Francisco Bay Area start-ups in scanning probe microscopy, electron microscopy and Raman spectroscopy. Dr. Gu authored 40+ articles in various peer-reviewed journals, books (chapter) and conferences. Allen Gu holds a PhD from Louisiana Tech University, LA, USA.

Dr Hijaz Kamal Hasnan is a researcher at Universiti Malaya’s Micro-CT Lab and was trained in X-Ray Micro-CT research at the Australian National University CT-Lab. The lab provides high-quality 3D images, analysis for the oil and gas industry, and medical, dental and engineering research within and outside Malaysia, which includes Petronas, Schlumberger, Sharjah University, Universiti Sains Malaysia and Bandung Institute of Technology.

Ms Bernice Zee holds a Master’s in Materials Engineering from Nanyang Technological University of Singapore. She has over ten years of industry experience in microelectronics packaging technology, particularly in flip-chip and 2.5D packages. She drives semiconductor packaging capability development in Product Development Engineering, Device Analysis Laboratory at Advanced Micro Devices (AMD) Singapore. She has been a peer reviewer for major conferences such as IPFA and ISTFA, leading conferences on failure analysis. Ms Zee also has over ten publications in package failure analysis.

Mr Joran joined ZEISS in 2017. He is dedicated to X-Ray microscopy and correlative microscopy technology support and application development. Till now, he has supported demos for more than 200 customers with ZEISS X-ray Microscopy and EM products. He has abundant experience in advanced packaging, especially innovating some fancy methods to make correlative workflow more practical for electronic failure analysis applications. Mr Joran got his master's degree from the Taiyuan University of Technology in China.