The Future of Microscopy in Materials Science

The ZEISS Sample-in-Volume Analysis workflow aims to provide navigational guidance to understand the structures-process properties of a material at different length scales. This workflow has four elements: Identifying, Accessing, Preparing and Analyzing samples. This workflow synergizes the latest innovations in multi-scale microscopy and enhances your correlative microscopy capabilities. We will explore the workflow and its applications in materials science, semiconductor materials and life science. This includes how the workflow can enhance existing workflows involving advanced imaging and analysis techniques such as TEM, Atom Probe Tomography and Synchrotron samples.

Learn how the ZEISS Xradia Versa 3D X-ray microscope (XRM) that features dual-stage magnification based on synchrotron-calibre optics and revolutionary RaaD™ (Resolution at a Distance) technology can provide superior 3D image quality of large sample volume for a wide range of materials. The XRM used to identify the region of interest has a resolution that surpasses the traditional micro-computed tomography. The AI-driven advanced reconstruction technologies, ART 3.0, that aim to accelerate productivity with faster time-to-results and improved image quality resolution and contrast will be presented.

Learn how the ZEISS Crossbeam family with an integrated dedicated femtosecond laser enables massive material ablation that rapidly and precisely accesses deeply buried regions of interest identified from an XRM. The Ion-sculptor Ga⁺ ion column on FIB-SEM provides the perfect solution for preparing high-quality samples, such as TEM lamellar and Atom Probe Tomography. Advanced microscopy insight such as low kV imaging, STEM and 3D FIB tomography on the Crossbeam FIB-SEM will be demonstrated. Lastly, learn how the ZEISS ATLAS 5 correlative software enables precise navigation and access to the identified ROIs that enable the correlative microscopy workflow.