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The ZEISS VersXRM 3D X-ray microscopes (XRM) provide non-destructive, submicron resolution imaging. Their 3D visualization and unlimited 2D "virtual cross sections" enable defect and failure analysis on intact samples, preserving sample integrity. Dual-stage magnification and RaaD™ technology maintain high resolution even for large samples, overcoming size limitations. Intuitive software allows easy navigation and site-specific acquisition. AI-enhanced reconstruction boosts data acquisition speed and contrast, breaking traditional limits on field of view, resolution, and throughput. This unique design and AI-powered software reduce sample costs while delivering best-in-class performance.

The ZEISS Sigma and GeminiSEM family of field-emission scanning electron microscopes (FE-SEM) provide subnanometer resolution and superior material contrast. Their spacious chamber, with multiple ports, supports various analytical detectors for material composition and grain analysis. This versatility suits a wide range of applications, including construction and failure analysis, passive voltage contrast, subsurface analysis, electrical measurements, and material characterization. User-friendly software enables seamless multi-tool integration, enhancing workflow efficiency.

The ZEISS Crossbeam FIB-SEM combines Gemini imaging with high-performance Ion sculptor Ga-FIB for efficient sample preparation. A femtosecond laser enables rapid, high-quality cross-sectioning of large interconnects and BEOL structures, even millimeters deep in 3D IC packages. Paired with 3D X-Ray data, it allows precise targeting of subsurface features. The Crossbeam’s capabilities include high-throughput 3D serial section imaging and workflows for TEM sample preparation.