Improve success rates in packaging failure analysis

with 3D X-ray Microscopy

While investigating the root cause of defects in advanced semiconductor packages, 3D XRM can help you visualize internal structures non-destructively, identify hidden faults, and guide precise sample preparation for further analysis.

Minimize mechanical sample preparation and cross-sectioning
Maintain sample integrity and prevent preparation artifacts
Visualize defect structures and failure types
Create a roadmap for further physical failure analysis workflows

Non-destructive 3D imaging

ZEISS 3D X-ray Microscopy (XRM) provides non-destructive, high-resolution visualization of embedded defects, preserving the integrity of both sample and defect structures. This solution integrates seamlessly into standard failure analysis (FA) workflows, enhancing the efficiency of subsequent physical FA for root cause determination.

Image a diverse array of samples, from modules to packages to interconnects
Obtain 3D insights and virtual cross-sections from any angle
Facilitate precise cross-sectioning with 3D navigational data

Achieve breakthrough resolution with cutting-edge imaging technology

Advanced packaging techniques, including heterogeneous integration and chiplets, are increasingly used in larger package platforms, challenging the resolution capabilities of traditional microCT systems.

ZEISS X-ray Microscopy pushes the boundaries of submicron-resolution 3D imaging and analysis, achieving an impressive 450 nm spatial resolution to visualize complex structures like 3D interconnects, redistribution layers (RDLs), through-silicon vias (TSVs), embedded bridges, hybrid bonds, solder bumps, and more.

Achieve superior contrast across a wide range of materials

Diverse materials like polymers, resins, adhesives, thermal interface materials, metal wires, traces, and solder are often challenging to visualize due to their low contrast.

ZEISS X-ray microscopes feature a uniquely designed architecture with advanced scintillator-coupled optics, delivering superior contrast to effectively visualize these materials.

Slide the arrow to compare standard X-ray imaging over a large field of view with the enhanced results using the Supercharger resolution deep-learning algorithm applied to the same area.

Experience award-winning, AI-powered reconstruction for high-throughput imaging

Innovative AI-based technologies are now addressing fundamental challenges in X-ray imaging, such as achieving high resolution with fast acquisition times and maintaining high resolution across large fields of view (FOV).

The deep learning-based reconstruction technique, ZEISS DeepRecon Pro, offers 4X faster scan times while enhancing image quality. Additionally, ZEISS DeepScout enables high-resolution imaging over large FOVs, drastically reducing the need for multiple long scans to capture the entire area.

Integrated, user-centric interface enables effortless scan setup

Simplify and optimize X-ray scan setups with the ZEISS NavX 2.0 XRM user interface, which:

Fast (~1 min) and precise navigation of sample to pinpoint high-resolution scan volume
Guides users with embedded, intelligent workflows
Provides easy, efficient results for novices and full versatility for experienced users
Augmented Reality for sample envelop, collision avoidance and 3D directions
Optimizes scans with on-screen guidance for varied user profiles (beginners, intermediate, advanced)
Enhances data management and archiving through automated file transfer