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Basic XRM failure analysis bundle
3D X-ray microscopy for semiconductor package analysis
2 MB
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Non-destructive failure analysis bundle
Non-destructive failure analysis
6 MB
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![Preview image of 3D X-ray microscopy for semiconductor package analysis]({"max":"/content/dam/rms/countries/singapore/apac/electronics-ebook-final-packageanalysisbasic.png/_jcr_content/renditions/cq5dam.thumbnail.319.319.png"} "Download 3D X-ray microscopy for semiconductor package analysis")
![Preview image of Non-destructive failure analysis]({"max":"/content/dam/rms/countries/singapore/apac/electronics-ebook-final-nondestructivefa.png/_jcr_content/renditions/cq5dam.thumbnail.319.319.png"} "Download Non-destructive failure analysis")