Learn how to use ZEISS XRM to improve success rates & efficiency for semiconductor package failure analysis

The semiconductor packaging industry is moving towards smaller and high density of interconnects with heterogeneous integration resulting in large package size.

Non-destructive imaging of these large packages with high-resolution pushes the limits of current X-ray microscopy and CT equipment.

The next-generation Xradia 630 Versa extends the frontiers of submicron-resolution 3D imaging and analysis, enabling unprecedented 450 nm spatial resolution upto 160kV X-ray energy.    

Diverse materials used in semiconductor packaging, such as polymers, resins, adhesives, thermal interface materials, and several other soft materials in addition to metal wires, traces, solder where visualization can be difficult due to their low contrast.

ZEISS Xradia Versa microscopes are designed with a unique architecture employing advanced scintillator coupled optics that provide superior contrast even for soft materials. This combined with resolution at a distance capability provides high resolution with high contrast in comparison to conventional X-ray CT. 

Some of the fundamental challenges in X-ray imaging such as high resolution at fast acquisition time and high-resolution at large field view are now being addressed with innovative AI based technologies.

Advanced reconstruction using deep learning, ZEISS DeepRecon Pro and DeepScout can provide more than 4X improvement in throughput, image quality and resolution recovery over large field of view. 

ZEISS NavX™, the new user interface for ZEISS Xradia 630 Versa, guides users through automated workflows with intelligent system insights and delivers experimental results more easily and efficiently while also allowing experienced users to explore the full versatility of the platform.

ZEISS NavX enables you to automate your workflow and provides guidance on the impact the parameters you've chosen will have on your setup. That guidance is directly embedded in the software, taking you through choices in a natural and familiar way.

Additionally, the ZEISS NavX File Transfer Utility (FTU) takes the data that is being produced by the microscope and automatically transfers it to other locations so that users have their data where they need it, when they need it. These advancements make ZEISS NavX much more capable for remote operation, advancing user productivity.

The semiconductor packaging workflow requires a comprehensive approach to inspection and analysis, involving multiple imaging techniques and data analysis tools.

ZEISS X-ray microscopes can integrate with other microscopy tools and data analysis software and help semiconductor manufacturers to develop connected workflows that streamline and guide the failure analysis, enabling them to identify and take corrective measures to improve yield and reliability more efficiently.