ZEISS Xradia Versa 3D X-ray Microscopes - Imaging buried defects non-destructively
Free Poster
Xradia Versa has become the industry standard for non-destructive 3D imaging of intact samples with sub-micron resolution. The unique detector design has enabled high resolution characterization of various components such as camera lenses and defects in electronic packages and batteries faster than conventional physical cross-sectioning in smartphones and electronics devices.
Download the poster for a preview!
![Get a clear overview of the principle of focused ion beam scanning electron microscopy (FIB-SEM).]({"small":"https://images.zeiss.com/Microscopy/sg/2022/apac/electronics-versa_poster-2_smartphone-images_print.ts-1643247273215.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=640&s=6b68d052c0bb61b7ae74bbc452491c55","large":"https://images.zeiss.com/Microscopy/sg/2022/apac/electronics-versa_poster-2_smartphone-images_print.ts-1643247273215.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1280&s=b5398a659e836d13c95f9f11f9f80638","medium":"https://images.zeiss.com/Microscopy/sg/2022/apac/electronics-versa_poster-2_smartphone-images_print.ts-1643247273215.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=832&s=4a86497f7e2db80fb9265a65bd91f322","full":"https://images.zeiss.com/Microscopy/sg/2022/apac/electronics-versa_poster-2_smartphone-images_print.ts-1643247273215.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1920&s=e8bd50cd3a1583c20807d3c600ad30fe"} "Get a clear overview of the principle of focused ion beam scanning electron microscopy (FIB-SEM).")