Achieve Rapid Package Failure Analysis and Process Optimization

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The Crossbeam laser enables high throughput sample preparation for rapid site specific failure analysis in 2.5/3D electronics packages. Access to image deeply buried interconnects and interfaces without any artifacts or damage are now easy and routine.

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Get a clear overview of the principle of focused ion beam scanning electron microscopy (FIB-SEM).

Achieve Rapid Package Failure Analysis and Process Optimization

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