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- ZEISS Electronics Seminar
The ZEISS Electronics Seminar aims to connect ZEISS and our partners to industry experts and thought leaders to understand and address the semiconductor and electronics industry challenges.
Target Audience
Industry experts and engineers in Semiconductor FA, Characterization and product development.
Topics
- Solutions for die-level failure analysis
- Advanced node electrical characterization and failure analysis
- X-Ray Microscopy for Package Development and FA
- LaserFIB for Advanced Packaging FA






In collaboration with


Semiconductor Die Level Analysis
Webinar 1
The first webinar of the Electronics Seminar series brings industry experts to share their experience in the failure analysis and characterization of semiconductor devices and industry trends and solutions for advanced package development. In addition, ZEISS and partner solutions for die-level failure analysis and electrical characterization will be presented. They will include a live demonstration of the Kleindiek nano probing solutions and capabilities on a ZEISS GeminiSEM.
Who should attend this webinar:
Failure Analysts, Product development, Yield Engineering engineers and managers at wafer foundries, fabless semiconductor companies, IDMs and service labs
The application of Bruker elemental analysis and Kleindiek nano-probing in ZEISS FE-SEM
Dr Yeoh Lai Seng | Infineon
As semiconductor features continue to shrink, nano-probing becomes important in isolating tiny physical defects down to the transistor level. Furthermore, the elemental mapping technique is essential to characterize the properties of the defect. This presentation will discuss the principles and applications of the Kleindiek nano-probing tool and Bruker EDX tool attached to the ZEISS FE-SEM.
Failure analysis and process characterization overview for Advanced packaging
Dr Zhao Si Ping | A*STAR Institute of Microelectronics
In this talk, Si Ping will briefly overview the current advanced packaging developments, the dynamics and exciting Moore than More trajectory. She will then share her views on process issues and defects, which could lead to yield loss and reliability concerns and the early detection and failure analysis challenges. Finally, she will conclude her talk with a forward-looking, exploratory review on combination inline – offline solutions.
Die Level Failure Analysis for Advanced Semiconductor Devices
Dr Chuan Wei Chung | ZEISS
Semiconductor device scaling in 3D dimensions and introducing complex architectures and materials have made failure analysis increasingly challenging. The workflow in the physical failure analysis involves multiple iterative steps with different tools and techniques starting from chip deprocessing with controlled layer by layer removal, inspection with light microscopes and SEM and defect localization with electrical characterization followed by defect characterization by FIB cross-section or TEM lamella preparation and analysis. In this presentation, we will present ZEISS solutions to address the challenges faced in these process steps to improve the throughput and success rate in the FA.
Kleindiek Live Virtual demo & Virtual Round table
Andreas Rummel & Dr Andrew Jonathan Smith | Kleindiek
Nanoprobing on current and future technology nodes pose challenges due to the devices' electron beam sensitivity. However, the ProbeWorkstation and its centrepiece, the PS8e Prober Shuttle, provide operators with the required tools and workflows to address these devices with ease - even at very low acceleration voltages. This will be demonstrated live by performing transistor characterization and EBIC experiments.
At the end of this session, you would have several learning outcomes, including
- Methods and techniques for die-level failure analysis
- Trends in advance packaging and challenges
- ZEISS Light Microscopy and Electron Microscopy solutions for die-level analysis
- Nanoprobing at low electron beam acceleration voltages
Advanced Package Development and Failure Analysis
Webinar 2
The second of the Electronics Week series focuses on ZEISS and partner solutions for the advanced packaging industry. Non-destructive imaging with an industry-leading X-Ray microscopy platform and developments in advanced machine learning to enhance image quality and high throughput will be presented. The importance of microstructural and material characterization and analysis of semiconductor die and electronic packages will be presented by Oxford Instruments. The final event will present the ZEISS Crossbeam laser applications in failure analysis and development of electronic packages with a live demo on the Crossbeam laser.
Who should attend this webinar:
Failure analysts and engineers, R&D and Product Development Engineers, Technology Development Managers at fabless design houses, foundries, service labs, and IDMs
Applications of Ultra-high Resolution 3D X-ray Microscopy on Advanced Packaging
Dr Kai-Ti Hsu | MA-Tek
Materials Analysis Technology Inc. (MA-tek) is a world-class laboratory providing services in materials analysis (MA), Failure Analysis (FA) and Reliability Testing (RT) services. We currently have 13 laboratories around the world and providing various technical services. MA-Tek has rich, extensive experience in the analysis field, with 3D OM, 3D X-ray, grinding, delayering, SEM, TEM, EDX, SCM, SIMS and other technologies. In this presentation, we will provide some applications of ultra-high-resolution 3D-X-Ray and other related analysis examples on advanced packaging.
EDS-EBSD analysis for semiconductor die and package
Dr Wu Jiang | Oxford Instruments
EDS and EBSD are important characterization tools that can qualify what elements are present within semiconductor chips, analyze microstructures of semiconductor devices, and detect local defects within samples. These are important information for understanding failures of semiconductor devices. In this presentation, several example case studies are provided, highlighting the power of the latest EBSD and EDS systems to solve key microstructural problems in the electronics industry. First, we present the microstructure characterization of 3D NAND Flash and transistor using the windowless EDS detector. In these cases, two analytical modes, the low kV EDS and STEM analysis, are introduced, which can achieve high-quality elemental maps with a spatial resolution better than 10nm. Second, the technique of identifying unknown compounds commonly formed at the jointing interface is discussed. This application is based on the EDS and EBSD integration system. Finally, we demonstrate compound identification and microstructure analysis workflow using the EBSD technique on three typical semiconductor packages, Al/Cu wire bonding, solder ball, and through-silicon via.

Improving Success Rates in Failure Analysis and Accelerating Next Generation Package Development Cycles with High-Resolution X-Ray Microscopy
Yanjing Yang | ZEISS
The developments in advanced packaging are driving the More-than-Moore era to improve system performance and increased functionality in integrated circuits. As a result, package developers and failure analysts are faced with complex package architectures, shrinking package interconnect pitches and system-on-chip (SOC) integration, which leads to larger package footprints. As a result, non-Destructive characterization at sub-micron resolution has become more than relevant in addressing the needs of semiconductor package FA. In addition, a workflow for 3D metrology of multiple repetitive parts with high repeatability and reproducibility is also now feasible that can accelerate package development and process optimization. This webinar will introduce the unique architecture and detection technology combined with advanced machine learning-based reconstruction in the Xradia Versa family of X-Ray microscopes, which have become industry standard tools for failure analysis and are being increasingly adopted to accelerate electronic package development.
Crossbeam Laser – The Packaging FIB
Live Demonstration
Dr Vignesh Viswanathan, Dr Wang Zhiqiang, Dr Jiao Longan | ZEISS
The focused ion beam platforms with FS-laser attachment have ushered in a new era of sample preparation capabilities. The ZEISS Crossbeam laser enables several applications that are challenging with conventional Ga FIB and plasma FIB. In this demonstration, we will introduce the unique features of the ZEISS Crossbeam laser, the operating principles and demonstrate sample preparation on IC packages.
At the end of this session, you would have several learning outcomes, including
- High-resolution EDS analysis for nanostructures in semiconductor dies
- Analyses of unknown compounds in various semiconductor packages by EBSD
- Characterization of complex microstructures within semiconductor samples
- Application of 3D X-ray microscopy to failure analysis of integrated circuit packages
- Advantages of 3D X-Ray microscopy technology over conventional CT
- How machine learning accelerates time to result and enhances image quality for FA
- Technical highlights of a new "packaging FIB" for improvement of FA workflow