ZEISS EVO Solutions for Electronics

The growing trends in 5G, IoT, and AI are driving consumer demand for high performance in electronic devices and components. Manufacturers are striving to achieve higher yield and defect-free chips. Scanning electron microscopy for visual inspection and composition analysis of surface features, defects in integrated circuits, semiconductor devices, LED, sensors and electronic packages have become routine and essential.

The EVO series is a high-performance scanning electron microscope with an intuitive, user-friendly interface to provide fast, reliable results. The preconfigured EVO 10 and 25 systems are flexible with upgrade-friendly options and modular features for various applications. This includes automated workflows to deliver high productivity and fast time to result with simplified operation, drastically reducing training costs.

The ZEN software suite allows the ability to combine images from different modalities for user-customized analysis that leverages advanced image processing and data analysis functions to provide insights and actionable information. Smart and automated features enable the automation of repetitive analysis tasks and reduce complex image segmentation and measurements of features in a simple, user-friendly manner, improving productivity and time to results at an affordable cost.

Combined with the ZEISS ZEN software suite, EVO "solution bundles" provide electronics and semiconductor solutions to address routine inspection, advanced automated materials/device analysis, critical feature, component measurement and metrology.


Routine Inspection

The tabletop SEM alternative for high performance imaging and data analysis

The miniaturization of electronic devices means electron microscopy is a standard technique used in visual inspection of surface features, morphology and defects. Routine inspection is important for assessing quality to support production and reliably validate process optimization.

The EVO 10 base configuration is an easy-to-use imaging tool that delivers quick, accurate, and repeatable results. The larger chamber and robust stage allows flexibility in a broad range of semiconductor die, wafers, integrated circuit packages, components and printed circuit boards.

When combined with the ZEN Core ecosystem, modular functionality can be added, such as data correlation between light and electron microscopy, advanced image analysis and data reporting functions to provide users with a complete solution for routine inspection and analysis. The platform is simple, easy to use and future upgrade compatible - all at an attractive price.

ZEN Correlative workspace combining optical and electron microscope image for inspection of LED
Electron micrograph of LED
High resolution electron micrograph of wire bond

ZEN Core is a powerful software suite that provides a unified user interface between ZEISS microscopy systems for simplified microscopy control with additional upgrade-friendly modules for data analysis and customized automated workflows.

  • Perform image manipulation, segmentation, and complex measurements and create workflow libraries that can be saved and recalled into automated routines.
  • Use the correlative workspace to combine images from different light microscopes, data from other modalities for context, comprehensive review and analysis.
  • Combine results to create analysis reports in user-configured report templates and export to various file formats.

Correlation and data analysis made simple and easy with ZEN Core software suite

Easy navigation to the region of interest from optical inspection to electron microscopy

  • Import any image from your existing light microscope utilizing different contrast mechanisms, or information from other fault isolation techniques and modalities to navigate to the region of interest.
  • Use fiducials on the sample for three-point alignment, eliminating the need for specific sample holders and allowing imaging of large sample sizes.


  • Image semiconductor die with a compound microscope with bright field and dark field contrasts for defect inspection on samples.
  • Load sample into SEM and acquire low magnification image.
  • Import light microscope data into ZEN Connect project and align the overview image with three-point alignment of sample features.
  • Identify regions of interest in the correlative workspace to navigate and acquire images for further inspection and analysis.
Correlative workflow in ZEN ecosystem

Image segmentation and data analysis – Applications in PCB additive analysis

  • Perform the image analysis offline with a simple set of steps to obtain the desired results.
  • Use the comprehensive library of image analysis functions and modules for segmenting and identifying features of interest with morphological filters or other attributes for further analysis.
  • Compute, extract and report key attributes of the features analyzed
  • Reuse and automate the workflow to batch process similar images with options to include user inputs.


  • Acquire secondary electron images of PCB laminate cross-section with ZEISS EVO SEM.
  • Import image with ZEN Analyzer and process with ZEN Image analysis module.
  • Draw a bounding box to highlight additives in the epoxy region. Use the threshold segmentation feature to segment and highlight additive particles from the epoxy.
  • Filter additive particles from surface scratches and artifacts with morphological filters for computation of particle size and area fraction.
  • Export results into graphs and import them into the report template for final documentation.
Image analysis performed to segment the fillers in the PCB laminate to obtain morphology and area fraction

Advanced Inspection and Analysis

The smart platform for advanced automated inspection and analytics​

Electron microscopy is an integral part of the inspection and failure analysis workflows in the electronics industry. Fault isolation using a combination of different techniques is followed by optical inspection and high-resolution electron microscopy with materials characterization using an EDS.

With the ZEISS EVO smart configurations, end-to-end workflows with automated inspection and accurate materials analysis combining advanced image analysis to deliver insights for actionable results are made simple and easy. With the smartVP configuration, image and analyze non-conductive electronic materials in a low vacuum. SmartSEM Touch, a user-friendly, multi-lingual touch interface with auto functions enhances efficiency and throughput for all users from novice to expert. Accurate composition analysis and characterization of various electronic materials and defects can be achieved with the integrated Oxford Xplore and Aztec Live One.

The ZEN suite of software and modules combines, organizes and manages all the data and results from the analysis into a single visual space. It also streamlines advanced machine learning-based image analysis and advanced workflows to provide higher throughput and efficiency for faster time to results and simplifies reporting in accordance with industry standards.

Advanced Workflows for automation and Data Analysis with Machine Learning

Automated inspection of smartphone motherboard and components

  • Simplify sample navigation with the navigation camera image or any other optical image of the sample.
  • Efficient automated large-area imaging selecting free-form regions of interest using custom acquisition parameters.
  • Review in context and manage your data with ease.


  • Capture digital camera image of a smartphone PCB; perform three-point registration directly within Automated Intelligent Imaging.
  • Select multiple areas for inspection using free-form and the rectangle boundary tool; specify each region with different magnification and parameters for image acquisition. Select multiple channels for imaging SE and BSE signals and start the automated acquisition.
  • After completion of automated imaging, the entire data set including the digital camera image is automatically imported into SmartBrowse for review in context.
  • Review individual tile images with SE and BSE signal to understand the topography and material composition information.

Analysis of SMT components: Solder joints and coating layer thickness

  • Drive your SEM inspection and materials analysis with optical inspection or fault isolation data.
  • Combine optical micrographs, electron microscopy and EDS data to correlate and manage all your data in one workspace for end-to-end analysis.
  • Simplified advanced machine learning-based segmentation and image analysis provide insights and data with minimal effort.


  • Perform optical inspection of cross-section samples, acquire images, and import them into ZEN Connect.
  • Use optical images to guide navigation to selective regions of interest for data acquisition from the electron microscope.
  • Acquired images are added to the ZEN Connect correlative workspace.
  • Import and align completed EDS data within ZEN Connect; combine all data for review with context.
  • Import and segment the upper corner image using advanced machine learning-based segmentation with ZEN Intellesis; use the layer thickness module for automated thickness measurements.

Metrology-supported Inspection & Analysis

Metrology and measurement with calibration-certified imaging

The measurement of critical features, layer thickness and reporting of statistical deviations for process control in compliance with ISO 9001 quality standards require a calibration-certified instrument and measurement solution. ZEISS offers calibration services for the EVO platform providing ISO 9001-compliant certificates to validate your measurement process. Repetitive measurements performed on the images can be automated with ZEISS Zaphire to provide accurate measurements of complex features and statistics for data-driven decision-making and actionable steps.

Measurements on a semiconductor die
Measurements on a cross-section image of the BEOL

ZEISS Zaphire offers optimized functions for importing microscopy data and brings metrology functionalities to microscopy providing higher quality and better productivity.

  • Create measurement plans based on example workpieces using automatic feature detection.
  • Perform predefined measurement tasks automatically and user-independently.
  • Compare measurements with CAD data to check for deviations.
  • Generate reports with ZEISS PiWeb.

Advanced workflows for repetitive measurements from microscopy images

Automated measurements in electronic packages

  • Create user-defined measurement templates to automate repeated measurements.
  • Advanced automated edge detection algorithms.
  • Trend analysis and statistical reporting.
Measurements of PCB via diameter and trace spacing
Advanced automated edge detection

ZEISS EVO 10 & 25

EVO configurations designed to meet your imaging, analysis and budget requirements


Base configuration

  • The ZEISS EVO 10, with the base package configuration offers a compact, robust and versatile imaging and analysis platform for routine materials characterization.
  • This package configuration extends performance, flexibility, and support beyond the limitations associated with tabletop SEMs.


Smart configuration

  • The EVO 10, with the smart package configuration integrates SmartSEM Touch an easy use, smart, intuitive and automated imaging and analysis capability.
  • An Oxford Instruments Xplore 30 mm EDX with the AZtecLiveOne analysis software provides a chemical characterization workflow.


SmartVP configuration

  • The EVO 10, with the pro package configuration provides a variable pressure capability to overcome imaging challenges associated with charging samples.
  • A range of variable pressure detector options, SmartSEM Touch for ease of use and an Oxford Instruments Xplore 30 mm EDX with the AZtecLiveOne provide a comprehensive range of capabilities.


Smart configuration

  • A high-performance industrial workhorse designed with a large chamber to accommodate large, bulky and heavy samples.
  • This package configuration combines the ability to inspect large samples while using the easy-to-use and automated capabilities of SmartSEM Touch. Oxford Instruments Xplore 30 mm EDX and AZtecLiveOne provide intuitive and productive chemical characterization workflows.

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