ZEISS EVO Solutions for Electronics
The growing trends in 5G, IoT, AI are driving consumer demand for high performance in electronic devices and components. Manufacturers are striving to achieve higher yield and defect-free chips. Scanning electron microscopy for visual inspection and composition analysis of surface features, defects in integrated circuits, semiconductor devices, LED, sensors and electronic packages have become routine and essential.
The EVO series is a high-performance scanning electron microscope with an intuitive, user-friendly interface to provide fast, reliable results. The preconfigured EVO 10 and 25 systems are flexible with upgrade friendly options and modular features for various applications. This includes automated workflows to deliver high productivity and fast time to result with simplified operation, drastically reducing training costs.
The ZEN software suite allows the ability to combine images from different modalities for user-customized analysis that leverage advanced image processing and data analysis functions to provide insights and actionable information. Smart and automated features enable automation of repetitive analysis tasks and reduce complex image segmentation and measurements of features in a simple, user-friendly manner, improving productivity and time to results at an affordable cost.
Combined with the ZEISS ZEN software suite, EVO "solution bundles" provide electronics and semiconductor solutions to address routine inspection, advanced automated materials and device analysis, and critical feature and component measurement and metrology.
Routine Inspection
The tabletop SEM alternative for high performance imaging and data analysis
The miniaturization of electronic devices means electron microscopy is a standard technique used in visual inspection of surface features, morphology and defects. Routine inspection is important for assessing quality to support production and reliably validating process optimization.
The EVO 10 base configuration is an easy-to-use imaging tool that delivers quick, accurate, and repeatable results. The larger chamber and robust stage allows flexibility in a broad range of semiconductor die, wafers, integrated circuit packages, components and printed circuit boards.
When combined with the ZEN Core ecosystem, modular functionality can be added, such as data correlation between light and electron microscopy, advanced image analysis and data reporting functions provide users a complete solution for routine inspection and analysis. The platform is simple, easy to use and future upgrade compatible - all at an attractive price.
ZEN Core is a powerful software suite that provides a unified user interface between ZEISS microscopy systems for simplified microscopy control with additional upgrade-friendly modules for data analysis and customized automated workflows.
- Perform image manipulation, segmentation, and complex measurements and create workflow libraries that can be saved and recalled into automated routines.
- Use the correlative workspace to combine images from different light microscopes, data from other modalities for context, comprehensive review and analysis.
- Combine results to create analysis reports in user-configured report templates and export to various file formats.
Correlation and data analysis made simple and easy with ZEN Core software suite
Easy navigation to region of interest from optical inspection to electron microscopy
- Import any image from your existing light microscope utilizing different contrast mechanisms, or information from other fault isolation techniques and modalities to navigate to the region of interest.
- Use fiducials on the sample for three-point alignment, eliminating the need for specific sample holders and allowing imaging of large sample size.
Image segmentation and data analysis – Applications in PCB additive analysis
- Perform the image analysis offline with simple set of steps to obtain the desired results.
- Use the comprehensive library of image analysis functions and modules for segmenting and identifying features of interest with morphological filters or other attributes for further analysis.
- Compute, extract and report key attributes of the features analyzed
- Reuse and automate the workflow to batch process similar images with options to include user inputs.

Advanced Inspection and Analysis
The smart platform for advanced automated inspection and analytics
Electron microscopy is an integral part of the inspection and failure analysis workflows in the electronics industry. Fault isolation using a combination of different techniques is followed by optical inspection and high-resolution electron microscopy with materials characterization using a EDS.
With the ZEISS EVO smart configurations, end-to-end workflows with automated inspection and accurate materials analysis combining advanced image analysis to deliver insights for actionable results is made simple and easy. With the smartVP configuration, image and analyze non-conductive electronic materials in low vacuum. SmartSEM Touch, a user friendly, multi-lingual touch interface with auto functions enhances efficiency and throughput for all users from novice to expert. Accurate composition analysis and characterization of various electronic materials and defects can be achieved with the integrated Oxford Xplore and Aztec Live One.
Advanced Workflows for automation and Data Analysis with Machine Learning
Automated inspection of smartphone motherboard and components
- Simplify sample navigation with the navigation camera image or any other optical image of the sample.
- Efficient automated large area imaging selecting free form regions of interest using custom acquisition parameters.
- Review in context and manage your data with ease.
Analysis of SMT components: Solder joints and coating layer thickness
- Drive your SEM inspection and materials analysis with optical inspection or fault isolation data.
- Combine optical micrographs, electron microscopy and EDS data to correlate and manage all your data in one workspace for end-to-end analysis.
- Simplified advanced machine learning based segmentation and image analysis provides insights and data with minimal effort.
Metrology-supported Inspection & Analysis
Metrology and measurement with calibration certified imaging
The measurement of critical features, layer thickness and reporting of statistical deviations for process control in compliance with ISO 9001 quality standards require a calibration certified instrument and measurement solution. ZEISS offers calibration services for the EVO platform providing ISO 9001-compliant certificates to validate your measurement process. Repetitive measurements performed on the images can be automated with ZEISS Zaphire to provide accurate measurements of complex features and statistics for data driven decision making and actionable steps.


ZEISS Zaphire offers optimized functions for importing microscopy data and brings metrology functionalities to microscopy providing higher quality and better productivity.
- Create measurement plans based on example workpieces using automatic feature detection.
- Perform predefined measurement tasks automatically and user-independently.
- Compare measurements with CAD data to check for deviations.
- Generate reports with ZEISS PiWeb.
Advanced workflows for repetitive measurements from microscopy images
Automated measurements in electronic packages
- Create user defined measurement templates to automate repeated measurements.
- Advanced automated edge detection algorithms.
- Trend analysis and statistics reporting.
ZEISS EVO 10 & 25
EVO configurations designed to meet your imaging, analysis and budget requirements
ZEISS EVO 10
Base configuration
- The ZEISS EVO 10, with the base package configuration offers a compact, robust and versatile imaging and analysis platform for routine materials characterization.
- This package configuration extends performance, flexibility, and support beyond the limitations associated with tabletop SEMs.

ZEISS EVO 10
Smart configuration
- The EVO 10, with the smart package configuration integrates SmartSEM Touch a easy to use, smart, intuitive and automated imaging and analysis capability.
- A Oxford Instruments Xplore 30 mm EDX with the AZtecLiveOne analysis software provides a chemical characterization workflow.

ZEISS EVO 10
SmartVP configuration
- The EVO 10, with the pro package configuration provides a variable pressure capability to overcomes imaging challenges associated with charging samples.
- A range of variable pressure detector options, SmartSEM Touch for ease of use and a Oxford Instruments Xplore 30 mm EDX with the AZtecLiveOne provide a comprehensive range of capabilities.

ZEISS EVO 25
Smart configuration
- A high-performance industrial workhorse designed with a large chamber to accommodate large, bulky and heavy samples.
- This package configuration combines the ability to inspect large samples while using the easy to use and automated capabilities of SmartSEM Touch. Oxford Instruments Xplore 30 mm EDX and AZtecLiveOne provide intuitive and productive chemical characterization workflows.
