ZEISS presented on the topic of “Developments in Advanced Packaging Failure Analysis using Correlated X-Ray Microscopy and LaserFIB” at EPTC.
We are hosting an online “Meet The Experts” session and we will be discussing the following topics –
1. Solutions for Package Failure Analysis and Development
2. Correlative X-Ray Microscopy to FIB-SEM workflows
You are cordially invited to participate in this session and engage with our experts and get any questions you need clarified.
We look forward to seeing you at the session!
Business Development Manager, Electronics, Asia Pacific
X-Ray Microscopes Specialist, Asia Pacific