One of the principal challenges when applying X-ray microscopy to solve academic and industrial problems is a compromise one needs to make between imaging throughput and image quality. High resolution 3D X-ray microtomography acquisition times can be on the order of several hours, which can lead to challenging return-on-investment (ROI) calculations when weighing the relative advantage of high accuracy 3D analysis with cheaper, less capable analytical techniques. The recent advances in 3D reconstruction using advanced machine learning algorithms has opened new ways to improve throughput significantly.
The Advanced Reconstruction Toolbox is an innovative platform on your ZEISS Xradia 3D X-ray microscope for accessing advanced reconstruction technologies. Unique modules leverage deep understanding of both X-ray physics and customer applications to solve some of the hardest imaging challenges in new and innovative ways.
With the Advanced Reconstruction Toolbox, you are able to:
- Improve data collection and analysis for accurate and faster decision-making
- Greatly enhance image quality
- Achieve superior interior tomography or throughput on a broad class of samples
- Reveal subtle difference through improved contrast-to-noise
- Increase speed at an order of magnitude for sample classes requiring repetitive workflow
These optional modules are workstation-based solutions for easy access and usability:
ZEISS OptiRecon is an implementation of iterative reconstruction that greatly increases acquisition throughput, while optimizing image quality.
ZEISS OptiRecon allows you to achieve good image quality with about one quarter of the data acquisition time for many samples typically found in the academic and industrial energy, engineering, natural resources, biological, semiconductor, manufacturing, and electronics research fields.
Slide right to left to compare:
4X Throughput for Mining Powder
Flexibility for Rock Exploration
– Image Quality vs. Throughput
4X Throughput for Battery Research
Flexibility for Battery Research
– Image Quality vs. Throughput
2X Throughput for 2.5D Semiconductor Package (50 mm x 75 mm)
Improved Image Quality for 2.5D Semiconductor Package (50 mm x 75)
2X Throughput for Semiconductor Package
Improved Image Quality for Semiconductor Package
ZEISS DeepRecon for ZEISS Xradia XRM is the first commercially available deep learning reconstruction technology. It enables you to increase throughput by an order of magnitude (up to 10X), without sacrificing novel XRM resolution-at-a-distance, for repetitive workflow applications. DeepRecon uniquely harvests the hidden opportunities in big data generated by your XRM and provides significant AI-driven speed or image quality improvement.
This webinar will discuss new AI-based reconstruction techniques that increase throughput and provide improved image quality, making 3D X-ray microtomography a powerful and cost-effective tool for an expanded range of markets, users, and applications.This webinar will discuss new AI-based reconstruction techniques that increase throughput and provide improved image quality, making 3D X-ray microtomography a powerful and cost-effective tool for an expanded range of markets, users, and applications.
In this webinar, you will learn:
- New reconstruction technologies enabling throughput or image quality improvements in 3D X-ray imaging
- Deep learning for repetitive workflows
- Iterative reconstruction for faster in situ
- Improved image quality for interior tomographies