Advancing Microscopy & Imaging Technologies

In our daily testing, we generate a large number of images. How can we use these images to quickly and effectively obtain statistical data, and even predict product quality? Zen Core software offers this possibilities. Traditional segmentation, machine learning and deep natural network (DNN) learning can support image processing and analysis. At the same time, Zen Core software can perform batch processing and reduce the time for data statistics and reporting to improve the productivity and efficiency.

We're advancing 3D X-ray imaging with the ZEISS VersaXRM 730, achieving submicron-resolution imaging at 450 nm. This boosts productivity and accelerates root cause analysis through faster scans. Traditionally, imaging fine-pitch interconnects and faulty regions in large semiconductor packages takes hours. Now, we speed up this process using AI. A deep learning method accelerates scan speeds by a factor of four.

Imagine analyzing deeply buried defects in semiconductor packages more efficiently. Our AI-driven X-ray imaging technique, combined with fs-laser/FIB-SEM workflows, makes this possible. How can you apply these advancements to improve your failure analysis and process development?

TEM sample preparation remains a critical task for semiconductor failure analysis and characterization, requiring precision, throughput, and quality. This session will focus on how ZEISS Crossbeam enables customers to navigate common challenges in TEM sample preparation while achieving greater efficiency and higher success rates in demanding workflows.

ZEISS Samplefab provides a fully automated solution for high-throughput, multi-site TEM sample preparation, delivering high lamella success rates with minimal user effort. This session will cover how its pre-configured FIB-SEM system, reliable automation, and easy-to-use interface help semiconductor labs improve efficiency, productivity, and repeatability.

Semiconductor packaging is becoming more complex, and conventional failure analysis techniques are struggling to keep up with its multi-dimensional architecture. This session will discuss on how ZEISS Crossbeam laser and ZEISS correlative microscopy, helps failure analysis labs quickly and efficiently locate, access, and characterize defects to improve yield.

Beyond the already challenging task of placing probe tips on the tiny contact pads that the most recent technology nodes' transistors yield, operators also have to work at very low acceleration voltages in order to avoid beam induced damage to the devices being tested. Adding probe tips to the mix makes imaging under the given conditions all the more challenging.

Combining Kleindiek Nanotechnik's nanoprobing technology with the ZEISS GemininiSEM 460 NP's low-kV imaging yields a powerful tool for efficient fault localization and fault characterization workflows.