
Prepare TEM Lamella at Your Regions of Interest With Unmatched Precision and Accuracy
with ZEISS FIB-SEMPreparing TEM lamella at targeted regions of interest is essential for advanced materials research, particularly when dealing with rare or precious samples where over-milling or inaccurate end-pointing are unacceptable outcomes.
To ensure reliable TEM sample preparation, real-time, high-resolution monitoring of the sample’s cross-section and thickness is crucial. In addition, a highly stable ion column ensures constant focus at the milling site, eliminating the need for repetitive probe realignment.
Discover how the ZEISS Ion Sculptor and Gemini electron column worked synergistically to deliver high resolution live imaging while milling of TEM samples - enabling precise, high-quality lamella preparation at your critical regions of interest.
Click register below to attend the free webinar & learn how...
- The field-free Gemini electron column enables high resolution live imaging while milling of TEM samples at any FIB / SEM kV
- The field-free Gemini electron column enables live, high-resolution monitoring of lamella thickness to achieve your desired electron-transparent sample
- The highly stable ZEISS ion column supports a simplified TEM workflow that eliminates the need for constant probe realignment
- The ZEISS ion column, designed for low-kV FIB processes, achieve minimal TEM sample amorphization with low kV FIB polishing
High Resolution Live Imaging While Milling at Any FIB/SEM kV
Do you struggle to precisely identify the critical region of interest in your sample during FIB milling process?
Learn how the immersion-free Gemini column works seamlessly with the FIB ion beam—supporting high resolution live imaging at any corresponding kV for precise, real-time end-pointing at your targeted region of interest.
Live TEM Lamella Thickness Monitoring
Do you struggle to prevent over-thinning or to monitor TEM lamella thickness to achieve the right electron transparency for further analysis?
Learn how the in-chamber detector enables real-time correlation between sample transparency and lamella thickness. This is made possible by the immersion-free Gemini electron column, which works seamlessly with the FIB ion beam to provide high-resolution live imaging for real-time TEM lamella thickness monitoring.
Simplified TEM Workflow Without Constant FIB Beam Realignment
Do you struggle to maintain the field of view, focus and astigmatism when switching FIB probe? These frequent FIB beam realignments are cumbersome and add time to your TEM lamella preparation.
Learn how the stability of the ZEISS ion column, Ion Sculptor, keeps the field of view focused even with changing probe current or EHT — simplifying TEM lamella preparation.


Minimal Sample Amorphization with Low kV Polishing
Do you struggle to image and perform final low-kV cleaning or polishing of your TEM lamella to maintain the highest sample quality.
The ZEISS Ion Sculptor column is optimized for low-kV FIB processes, providing detailed imaging and a precise ion beam profile—even at 1 or 0.5 kV—ideal for final polishing at your targeted region of interest.

The Crossbeam Family carries the next-generation focused ion beam column, Ion-sculptor, featuring high currents for high throughput and excellent low voltage performance for high sample quality.
- Maximize sample quality by using the low voltage capabilities of the Ion-sculptor FIB column
- Minimize amorphization of your specimens and get the best results after thinning
- Get precise and reproducible results with maximum stability
- Accelerate your FIB applications with fast probe current exchanges
- Perform high throughput experiments thanks to beam currents of up to 100 nA
- Achieve exceptional FIB resolution of less than 3 nm
- The Crossbeam family comes with automatic FIB emission recovery for long-term experiment