ZEISS Crossbeam - FIB-SEM for High Throughput 3D Analysis and Sample Preparation

Semiconductor Failure Analysis

ZEISS Crossbeam Laser

FIB-SEM for high throughput sample preparation and nanoscale imaging

Parallel advances in FIB-SEM and ultra-fast lasers have radically changed sample preparation, characterization and failure analysis of semiconductor devices and packages.

Speed up sample preparation by integrating a femtosecond laser onto a FIB-SEM
Achieve unprecedented speed and versatility in accessing deep and buried regions of interest, enabling detailed structural analysis across various sample types
Target multiple ROIs with integrated automated movements with high accuracy and speed
Unlock new approaches to provide greater insights into semiconductor package research, development and failure analysis

A multi-chip package with copper microbumps and flip chip interconnect, laser-milled and FIB-polished cross-section, trench depth 1.6mm.

A multi-chip package with copper microbumps and flip chip interconnect, laser-milled and FIB-polished cross-section, trench depth 1.6mm.

1. Rapid Access, Optimized Preparation and Multiple Scales

Reveal deeply buried structures orders of magnitude faster than PFIB (Plasma FIB)
Ensure minimal damage and heat affected zones due to femtosecond laser processing in a controlled environment
Maintain an air free workflow from laser processing to analysis in the FIB; select nitrogen or argon as your environment gas
Correlate your ROIs with previously acquired 3D XRM or other external datasets via a tailored workflow
Increase the speed of ablation and its performance using the new Burst Mode
LaserFIB, details, laser chamber and laser optics to the right, FIB-SEM chamber to the left.

LaserFIB, details, laser chamber and laser optics to the right, FIB-SEM chamber to the left.

2. Workflow Automation

Automated shuttling and laser processing lets you save time and increase throughput when preparing multiple samples with your LaserFIB
Remotely operate the system and create unattended automated experiments using the laser, the motorized transfer rod and subsequentially the FIB-SEM
One click in the software now performs the registration procedure between laser and FIB-SEM
Scripting enables automated workflow creation and increases efficiency in your experiments
Use scripting further to combine different recipes or activate vacuum conditions (nitrogen or argon gas)
Three trenches laser-milled in copper, with cross-jet off (top) and on (bottom).

Three trenches laser-milled in copper, with cross-jet off (top) and on (bottom).

3. Maintain Cleanliness, Ensure Throughput and Ease-Of- Use

Perform laser work in a dedicated integrated chamber to maintain cleanliness of your FIB-SEM main chamber and detectors
Benefit from the protective glass window and the cross-jet. The cross-jet, a gas flow of either nitrogen or argon, prevents ablated material to deposit on the protective glass underneath the laser optics and keeps it clean during laser processing.
The laser also helps to clean redeposited material around trenches especially during multi-site preparation
Array of 25 pillars in silicon, laser milled in about 30 seconds, using Burst Mode, ready for fine polishing with the Gallium FIB.

Array of 25 pillars in silicon, laser milled in about 30 seconds, using Burst Mode, ready for fine polishing with the Gallium FIB.

4. Enter a New World of Sample Preparation

Combine the benefits of the fs laser and Ga FIB and prepare a multitude of samples from huge cross-sections, TEM lamellae and atom probe tomography samples to arrays of pillars for micro compression testing or synchrotron microscopy and nanoCT
Machine extremely large cross-sections up to millimeters in width and depth using the fs laser
Remove specific layers of material with the laser using patent pending precision depth milling
Find suitable parameters for efficient laser processing easily by using pre-installed recipes or define your workflows individually.

Ultrafast laser-enhanced material removal

For Efficient Sample Preparation

Addition of a femtosecond laser to the ZEISS Crossbeam FIB-SEM improves the material removal rates up to 15 mio µm³ per second.

Sample preparation is efficient with minimal heat-affected zone due to the ultrashort pulse duration of the femtosecond laser.

This reduces sample preparation from hours or days to minutes without any artifacts. The laser preparation is suitable for several materials including silicon carbide and glass.

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Large volume and contamination free milling

with isolated laser chamber and Cross-Jet

Accessing structures buried millimetres deep in the package and removal of several cubic mm is now routinely feasible enabling large cross-sections of the entire capacitors, TIM interface through the metal lid, etc

An isolated laser chamber segregates ablation contaminants from the main imaging chamber, maintaining the highest-resolution imaging capability while keeping maintenance costs low.

The new cross-jet, a gas flow of either nitrogen or argon, prevents ablated material to deposit on the protective glass. This enables continuous working for several hours while maintaining consistent laser power and ablation rates.

Download free ZEISS Crossbeam Laser bundle

Automation for precision and productivity

Targeting multiple ROIs and cross-section preparation

Automated shuttling and laser processing in a separate chamber lets you save time and increase throughput, whilst scripting enables automated workflow creation, boosting efficiency in your experiments.

Targeting multiple ROIs and preparation of cross-sections, H-bars, TEM lamella preparation and Atom Probe tomography samples can be automated.

Download free ZEISS Crossbeam Laser bundle

Achieve micron scale precision

With ZEISS Crossbeam Laser

ZEISS Crossbeam laser tools utilize calibrated laser positioning in a separate chamber to achieve precise targeted sample preparation.

When combined with 3D X-ray data and surface feature registration using SEM imaging in the main chamber, targeting surface and hidden defects deeply buried in the semiconductor package can be routinely achieved with an accuracy better than 2 microns. This enables high throughput targeted sample preparation compared to other conventional techniques

Download free ZEISS Crossbeam Laser bundle

Further enhance your productivity

With X-ray guided connected workflow

Discover workflows on ZEISS Crossbeam Laser

Explore how guided workflows help you to tailor Laser, TEM Lamella preparation and correlated Cryo workflows

Watch this animation and discover how the LaserFIB workflow helps you to optimize and automate laser processing.