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3D X-ray Microscopy
Know Before You Go: Visualize in 3D Without Altering Your Defect
Improve success rates & efficiency for semiconductor package failure analysis
While searching for the root cause of problems in your device,
3D X-ray microscopy (XRM) can help you…
ZEISS 3D XRM Enables Accurate Insights
- Unique optics provide non-destructive imaging of intact samples with submicron resolution
- Intuitive, true 3D visualization with unlimited 2D “virtual cross sections” from any angle
- AI-enabled software enables high-speed data acquisition and high contrast imaging
- Hardware flexibility ensures optimized signal strength, throughput, and resolution on every sample
- Easy navigation to any site in the sample allows accurate and fast set ups
Non-Destructive 3D XRM for Failure Analysis
Take a Deeper Dive into How XRM is Used to Transform Your FA Workflow
Downloads
-
Electronics Failure Analysis Brochure
Pages: 8File size: 7 MB -
Tech Brief: Non-destructive FA using 3D XRM
Pages: 2File size: 970 KB
![Preview image of Electronics Failure Analysis Brochure]({"max":"/content/dam/z/rms/countries/united-states/campaigns/xrm-packaging/xeiss_xradia_download_quality.jpg/jcr:content/renditions/cq5dam.thumbnail.319.319.png"} "Download Electronics Failure Analysis Brochure")
![Preview image of Tech Brief: Non-destructive FA using 3D XRM]({"max":"/content/dam/z/rms/countries/united-states/campaigns/xrm-packaging/tech-brief-1.jpg/jcr:content/renditions/cq5dam.thumbnail.319.319.png"} "Download Tech Brief: Non-destructive FA using 3D XRM")