ZEISS Process Control Solutions for Semiconductors
INNOVATIONMADE BY ZEISS
Booth #1124 See you in KL! 22-24.05.18
Accelerating new processes for next-generation devices. ZEISS Process Control Solutions
INNOVATIONMADE BY ZEISS

22 - 24 May 2018, 10:00 AM - 5:00 PM | Booth #1124 MITEC, Kuala Lumpur, Malaysia

SEMICON Southeast Asia 2018

Presenting ZEISS Solutions for Semiconductors

As the complexity and variety of semiconductor technologies continues to increase, so do the challenges for process control technologies. Modern manufacturing techniques are increasingly incorporating novel materials and more complex 3D structures to meet rapidly evolving market demands. Resulting new processes are driving the need for new failure analysis and process control methods.


ZEISS invites you to Booth #1124 to discover solutions for a wide range of applications in the semiconductor industry. At the show, you will experience:
 

  • ZEISS Xradia Versa 520 Model
  • ZEISS Axio Imager.Z2 Vario with a 300mm stage
  • ZEISS Smartproof 5
  • Dedicated stations for ZEISS Crossbeam and ORION NanoFab
  • A talk by ZEISS
  • A chance to win ZEISS VR ONE Plus Virtual Reality Headsets

A team of experienced Application Specialists will be at the booth to answer any questions you may have in your research work.

Talk by ZEISS

High-Resolution 3D X-Ray Metrology for Semiconductor Packaging Development and Assembly

Speaker: Dr. Allen Gu, ZEISS Semiconductor Manufacturing Technology, USA
23 May 2018, Wednesday, 3:10 PM to 3:35 PM
Venue: IC Failure Analysis and Defects Characterisation Forum

The 3D X-ray microscopic (XRM) imaging technique has become integrated in the electronics package failure analysis workflow because it can visualize buried defective regions without the need to destroy a specimen. In this paper we propose a new XRM application that enables a non-destructive metrology at unparalleled sub-micron resolution in three-dimension. Because the measurement is based on full-angle 3D tomography, it is possible to generate rich volumetric information on a variety of packaging structures that cannot be measured by the traditional cross-section technique.

Additionally, the XRM based metrology has an advantage over the traditional coordinate measuring machines (CMM) technique because it can measure internal structures, which are not physically accessible by CMM probes. To the best of our knowledge, the 3D non-destructive metrology as shown here for the measurement of buried 3D interconnects in semiconductor packages at sub-micron resolution has not been reported previously.

Several smartphone camera modules were used to develop and test this metrology workflow. The measurement focused on two major components in the camera module: CMOS imaging sensor (CIS) package and lens optics assembly. After the samples were imaged with XRM at high resolution, a measurement workflow followed to extract Au bump height, volume, surface area, and other critical dimensions in the CIS package. In the case of lens optics assembly, the measurements were the lens gap between multiple-layer stacks, lens thickness, lens tilt and de-centricity. The lens tilt and de-center measurements were obtained on both in-plane and out-of-plane orientations. A local adaptive surface determination algorithm was used to probe lens surface with sub-pixel accuracy and precision. The workflow was scripted to test multiple repetitive parts for high repeatability and reproducibility. Other 3D metrics may be developed with this metrology workflow.

Due to the increasing complexity of emerging 3D packages, the packaging industry faces challenges for finding effective inspection and metrology techniques. The 3D X-ray metrology proposed in this paper offers a potential solution, because it uniquely enables non-destructive 3D metrology at submicron resolution.

read abstract
hide

Solutions at the Booth

ZEISS Xradia Versa 3D X-ray Microscopes

ZEISS Xradia Versa 3D X-ray Microscopes

Non-destructive High Resolution Fault Imaging

Extend the boundaries of non-destructive physical failure analysis (PFA) and production quality control (QC) for semiconductor packages with your ZEISS X-ray microscope. Acquire high-resolution 3D images and tomography of fault locations within fully intact packages, and view virtual cross-sections in any orientation with <700 nm resolution.

Read more
ZEISS Axio Imager.Z2 Vario
ZEISS Axio Imager.Z2 Vario
Examine Large Samples – Automated and Clean Room Compatible

Analyze smallest MEMS sensors up to XXL wafer or even entire flat planel panel displays without destroying them. Thanks to the sample height of up to 254 mm and lateral space of up to 300 mm you examine the broadest range of samples with Axio Imager Vario. The column design offers high stability. Take control of your wafer in the clean room – Axio Imager Vario is certified to DIN EN ISO 14644-1 and meets Class 5 requirements. A motorized z-drive in addition with the hardware auto focus ensure the automatic setting of the optimum focus position.

Read more
ZEISS Smartproof 5
ZEISS Smartproof 5
Integrated Widefield Confocal Microscope for Surface Analysis

The versatile ZEISS Smartproof 5 is fast, precise and repeatable. Put it to work on a wide range of industrial applications - such as roughness and topographical characterization - that come up every day in QA/QC departments, production environments and R&D labs.

Read more

Details

SEMICON Southeast Asia 2018
22 - 24 May 2018
10:00 AM - 5:00 PM

Venue:

Floor plan
Booth #1124, Malaysia International Trade and Exhibition Centre (MITEC)
Jalan Dutamas 2, Kompleks Kerajaan
50480 Kuala Lumpur
Malaysia
Directions

Contact

Inquiries
Email

Receive Updates
Latest news and offers
We use cookies on this site. Cookies are small text files that are stored on your computer by websites. Cookies are widely used and help to optimize the pages that you view. By using this site, you agree to their use. more