June 21-23, 2022


Paving the way for your next-generation devices

Visit us at SEMICON 2022, the premier semiconductor event in SEA, and find answers to your questions.

Let's connect in Penang

June 21-23, 2022 | Booth A516

ZEISS Xradia 620 Versa

3D X-ray Microscopy for Faster Sub-Micron Imaging of Intact Samples

ZEISS Smartproof 5

Your Integrated Widefield Confocal Microscope for Surface Analysis in Quality Assurance and Quality Control

ZEISS Axio Imager Vario

Examine large specimens with automated processes – compatible with clean rooms

ZEISS Seminar | 23 June, Room 7

Join our seminar with microscopy experts

Through live demonstrations & interesting lectures from industry and academia speakers, we aim to connect ZEISS and our partners to industry experts and thought leaders to understand and address the semiconductor and electronics industry challenges.

Agenda at a glance

09.00 | Guest registration

10.00 | Welcome speech

Tian Kooi Chin | Head of Sales, ZEISS

10.15 | ZEISS Light Microscopy Session
Expert Technical Talk

Topic: Enhanced Workflow for Advance Die Failure Analysis with a Unique Light Microscopy Contrasting Method and Precise Laser Marking
Dr. Siang Hui Lim | Senior Product & Application Sales Specialist, ZEISS


The failure analysis (FA) process aims to determine the root cause of failure mechanisms and address physical defects arising from fab-related processes and other non-conformance of the device to its electrical and/or visual/mechanical specifications. The FA process typically begins with electronic functional tests to categorize the failure observed by non-destructive methods and subsequently localize the ROI to smaller regions in the device. This fault isolation process is followed by physical failure analysis involving deprocessing or delayering which is a destructive process that consists of systematic layer-by-layer removal of the die, i.e. through controlled mechanical polishing or focused ion beam etching. However, each approach has its challenges. For example, during manual delayering through mechanical polishing, end pointing at the desired layer needs a frequent inspection in SEM since the fast and preferred optical inspection with traditional brightfield contrast has limitations. Meanwhile, for focused ion beam etching, the challenge is to re-locate the ROI in SEM as the Flat Passivation surface lacks any topology or pattern for navigation under SEM/FIB, so further investigation is impossible. This talk will examine each method and discuss how we can improve the workflow.


Dr Siang Hui LIM completed his PhD in Biopharmacy from the University of Malaya (2013). From 2007 to 2013, he served as a Senior Research Scientist at Cancer Research Initiatives Foundation (Malaysia), where he worked on applying dyes and pigments, also known as the photosensitizers, for the treatment and diagnosis of cancer. Using the confocal microscopy technique, he investigated the pharmacology properties of these photosensitizers on cancer. He also has experience in light illumination setup for in vivo models such as chick embryo chorioallantoic membrane assay and murine tumour model. In December 2013, Siang Hui joined ZEISS as an application specialist. He is mainly in charge of the Bioscience application of light microscopes, wide-field fluorescence systems, automated digital imaging platforms, and confocal LSM.

11.00 | Light Microscopy Demonstration | Show & Tell Session

Matchmaking session and live demo session

12.00 | ZEISS Connect Lunch

Lunch and refreshments will be provided

14.00 | ZEISS X-Ray Microscopy Session
Special Industrial Technical Talk

Topic: The application of X-Ray Micro-CT in Science and Engineering
Dr. Hijaz Kamal bin Hasnan | Department of Geology, Faculty of Science, University of Malaya


Understanding natural phenomena and engineering properties need nano- to micron-scale observation. High-resolution imaging techniques like SEM are limited to 2D perspectives. X-Ray Micro-CT imaging provides high-resolution 3D images, which adds value and quality to the output of many research and development projects and high-precision manufacturing. In my talk, we will explore the capabilities of Micro-CT imaging through my previous and current research and other fields, such as semiconductors and engineering.


Currently a Senior Lecturer at the Department of Geology, Faculty of Science, Universiti Malaya since 2020. Also part of the Petroleum Geology Research Group and current supervisor of Universiti Malaya’s Micro-CT Lab.


  • 2.5 years in MEME Electronic Materials
  • PhD in Applied Maths, Australian National University, 2020
  • PhD in Petroleum Geology, Universiti Malaya, 2020
  • Master of Engineering in Petroleum Engineering, University of Adelaide, 2013
  • Bachelor of Engineering in Mechanical Engineering, University of Adelaide, 2009
  • First-authored in 2 ISI-indexed journal articles


15.00 | ZEISS X-Ray Microscopy Session

Topic: Improving Success Rates in Failure Analysis and Accelerating Next Generation Package Development Cycles with High-Resolution X-Ray Microscopy
Yanjing Yang | X-Ray Microscopes Specialist, ZEISS


The developments in advanced packaging are driving the More-than-Moore era to improve system performance and increase functionality in integrated circuits. As a result, package developers and failure analysts are faced with complex package architectures, shrinking package interconnect pitches and system-on-chip (SOC) integration, which leads to larger package footprints. As a result, non-Destructive characterization at sub-micron resolution has become more than relevant in addressing the needs of semiconductor package FA. In addition, a workflow for 3D metrology of multiple repetitive parts with high repeatability and reproducibility is also now feasible that can accelerate package development and process optimization. This talk will introduce the unique architecture and detection technology combined with advanced machine learning-based reconstruction in the Xradia Versa family of X-Ray microscopes, which have become industry standard tools for failure analysis and are being increasingly adopted to accelerate electronic package development.


Yanjing joined ZEISS in September 2018 as Regional Product and Application Sales Specialist, mainly in charge of the X-Ray Microscopies, and developed the workflow for semiconductor customers. She has more than ten years of experience in physical/surface analysis in the semiconductor industry. She worked in GlobalFoundries Singapore and Samsung Austin Semiconductor before, focusing on both die-level and package level Failure Analysis. She graduated in Electrical & Electronics Engineering and Industry System Engineering from the National University of Singapore.

17.00 | Closing & Lucky Draw

A raffle draw will be conducted for all attendees present

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