In collaboration with ON Semiconductor, we are excited to host the Virtual Electronics Summit. It is consisting of three master classes for ON Semiconductor personnel in South-East Asia.
In this virtual summit, we will explore and discuss how advances in FE-SEM, Crossbeam and X-Ray Microscopy can help ON Semiconductor reach its goals.
- Navigate through charging samples
- Low kV imaging
- Artefact-free sample preparation
- Site-specific x-sectioning
- Non-destructive 3D-imaging of buried defects
Join us for live talks and Q&As with knowledgeable microscopy experts.
We welcome you to attend just one or more sessions.
As semiconductor devices become smaller, faster and more complex, IC designers have adopted 3D architectures having high interconnect density and implemented novel materials. Shrinking feature sizes and beam sensitive materials drive a requirement for excellent SEM performance at the low acceleration voltages and currents used during device characterization and fault isolation. ZEISS GeminiSEM field-emission scanning electron microscopes (FE-SEM) are optimized to meet these challenges.
In this webinar, we will introduce to you our latest innovation of the GeminiSEM platform in ZEISS. We will explain to you the principle, advantages and applications example of our field-free Gemini column that is tailored for excellent resolution and contrast on semiconductor samples at extreme low accelerating voltages; provides surface-sensitive imaging and superior contrast to differentiate device layers of similar compositions and nanoscale thicknesses, while ensuring the device and its defects are not damaged or electrically altered by the electron beam. These key benefits on GeminiSEM are prominently required in passive voltage contrast and nano probing techniques, which is a part of semiconductor failure analysis solutions nowadays.
Kasem Bau, Product & Application Specialist
As the semiconductor devices and packaging complexity has changed drastically, it created a challenge in the process control and failure analysis methodology. Fast time to result with high target accuracy and artefact-free sample preparation technique is the key to meeting the semiconductor industry’s challenges today.
This webinar will introduce how ZEISS Crossbeam Laser (FIB-SEM) are an effective and optimized solution to meet these challenges. It is a site-specific cross-section solution enabling faster semiconductor package failure analysis and process optimization with laser integrates an fs-laser for speed, a Ga+ beam for accuracy, and an SEM for high-resolution imaging to enable the fastest workflows. In addition, the completed as well as correlated workflow also will be introduced in this webinar to ensure that you will obtain optimal information and benefit from the sharing.
Kasem Bau, Product & Application Specialist
As the complexity and variety of semiconductor technologies continue to increase, so do the challenges for process control technologies. In addition, modern manufacturing techniques increasingly incorporate novel materials and more complex 3D structures to meet rapidly evolving market demands. ZEISS’s ongoing development of these technologies is key to meeting the semiconductor industry’s challenges for next-generation devices.
ZEISS brings decades of semiconductor equipment experience to the semiconductor market and has recently broadened the new solution with high-resolution 3D X-ray imaging systems. These new solutions are designed to provide the ultimate in submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures. They include enhanced submicron and nanoscale 3D X-ray microscopes (XRM) – helping enable packaging product development, process optimization and failure analysis for advanced semiconductor packages.
This webinar will look at how ZEISS Xradia Versa 3D X-ray microscopes (XRM) are an effective solution for non-destructive visualization and characterization of submicron defects buried within intact 3D packages.
Yanjing Yang, X-Ray Microscopes Specialist
Mr Kasem Bau is a graduate of Diploma in Mechanical Engineering from the Sultan Abdul Halim Mu’adzam Shah Polytechnic, Malaysia, in 2001 and currently pursuing a Bachelor of Technology (Hons) in Electronics at Wawasan Open University. He has 18 years of working experience in the semiconductor and nanotechnology industries with 10 years of direct involvement in the electron microscopy applications technical support field. He began his career as an Associate Engineer responsible for the process and application of both optical and electron beam defect inspection equipment at SilTerra Malaysia and Chartered Semiconductor Singapore from the year 2002 until 2010. He then joined Crest NanoSolutions (M) Sdn. Bhd. in Aug 2010, as Application Engineer and responsible for providing application technical support for developing and implementing Thermo Fisher Scientific's Scanning Electron Microscope (SEM) and Focus Ion Beam (FIB) to electronics and semiconductor industries in South East Asia region. Since Nov 2020, Kasem joins ZEISS Malaysia as Regional Product and Application Sales Specialist. He is mainly in charge of the products of EM such as FIB-SEM, FE-SEM and C-SEM.
Yanjing joined ZEISS in September 2018 as Regional Product and Application Sales Specialist, mainly in charge of the X-Ray Microscopies, and developed the workflow for semiconductor customers. She has more than 10 years of experience in physical/surface analysis in the semiconductor industry. She worked in GlobalFoundries Singapore and Samsung Austin Semiconductor before, focusing on both die-level and package level Failure Analysis. She graduated from Electrical & Electronics Engineering and Industry System Engineering at the National University of Singapore.