As semiconductor features continue to shrink, nano-probing becomes important in isolating tiny physical defects down to the transistor level. Furthermore, the elemental mapping technique is essential to characterize the properties of the defect. This presentation will discuss the principles and applications of the Kleindiek nano-probing tool and Bruker EDX tool attached to the ZEISS FE-SEM.
In this talk, Si Ping will briefly overview the current advanced packaging developments, the dynamics and exciting Moore than More trajectory. She will then share her views on process issues and defects, which could lead to yield loss and reliability concerns and the early detection and failure analysis challenges. Finally, she will conclude her talk with a forward-looking, exploratory review on combination inline – offline solutions.
A*STAR Institute of Microelectronics
Semiconductor device scaling in 3D dimensions and introducing complex architectures and materials have made failure analysis increasingly challenging. The workflow in the physical failure analysis involves multiple iterative steps with different tools and techniques starting from chip deprocessing with controlled layer by layer removal, inspection with light microscopes and SEM and defect localization with electrical characterization followed by defect characterization by FIB cross-section or TEM lamella preparation and analysis. In this presentation, we will present ZEISS solutions to address the challenges faced in these process steps to improve the throughput and success rate in the FA.
Nanoprobing on current and future technology nodes pose challenges due to the devices' electron beam sensitivity. However, the ProbeWorkstation and its centrepiece, the PS8e Prober Shuttle, provide operators with the required tools and workflows to address these devices with ease - even at very low acceleration voltages. This will be demonstrated live by performing transistor characterization and EBIC experiments.
Materials Analysis Technology Inc. (MA-tek) is a world-class laboratory providing services in materials analysis (MA), Failure Analysis (FA) and Reliability Testing (RT) services. We currently have 13 laboratories around the world and provide various technical services. MA-Tek has rich, extensive experience in the analysis field, with 3D OM, 3D X-ray, grinding, delayering, SEM, TEM, EDX, SCM, SIMS and other technologies. In this presentation, we will provide some applications of ultra-high-resolution 3D-X-Ray and other related analysis examples on advanced packaging.
EDS and EBSD are important characterization tools that can qualify what elements are present within semiconductor chips, analyze microstructures of semiconductor devices, and detect local defects within samples. These are important information for understanding failures of semiconductor devices. In this presentation, several example case studies are provided, highlighting the power of the latest EBSD and EDS systems to solve key microstructural problems in the electronics industry. First, we present the microstructure characterization of 3D NAND Flash and transistor using the windowless EDS detector. In these cases, two analytical modes, the low kV EDS and STEM analysis, are introduced, which can achieve high-quality elemental maps with a spatial resolution better than 10nm. Second, the technique of identifying unknown compounds commonly formed at the jointing interface is discussed. This application is based on the EDS and EBSD integration system. Finally, we demonstrate compound identification and microstructure analysis workflow using the EBSD technique on three typical semiconductor packages, Al/Cu wire bonding, solder ball, and through-silicon via.
The developments in advanced packaging are driving the More-than-Moore era to improve system performance and increased functionality in integrated circuits. As a result, package developers and failure analysts are faced with complex package architectures, shrinking package interconnect pitches and system-on-chip (SOC) integration, which leads to larger package footprints. As a result, non-Destructive characterization at sub-micron resolution has become more than relevant in addressing the needs of semiconductor package FA. In addition, a workflow for 3D metrology of multiple repetitive parts with high repeatability and reproducibility is also now feasible that can accelerate package development and process optimization. This webinar will introduce the unique architecture and detection technology combined with advanced machine learning-based reconstruction in the Xradia Versa family of X-Ray microscopes, which have become industry standard tools for failure analysis and are being increasingly adopted to accelerate electronic package development.
The focused ion beam platforms with FS-laser attachment have ushered in a new era of sample preparation capabilities. The ZEISS Crossbeam laser enables several applications that are challenging with conventional Ga FIB and plasma FIB. In this demonstration, we will introduce the unique features of the ZEISS Crossbeam laser, the operating principles and demonstrate sample preparation on IC packages.