ZEISS Electronics Seminar

October 14 & 21, 2021

Join our seminar with Microscopy experts

Live demonstrations & interesting lectures from renowned industry and academia speakers

The ZEISS Electronics Seminar aims to connect ZEISS and our partners to industry experts and thought leaders to understand and address the semiconductor and electronics industry challenges.

Target Audience
Industry experts and engineers in Semiconductor FA, Characterization and product development.

Topics

  • Solutions for die-level failure analysis
  • Advanced node electrical characterization and failure analysis
  • X-Ray Microscopy for Package Development and FA
  • LaserFIB for Advanced Packaging FA

Choose one or more live sessions below.

In collaboration with

Semiconductor Die Level Analysis

Day 1

Thursday, 14th October 2021

2 PM - 5 PM SGT

The first day of the Electronics Seminar series brings industry experts to share their experience in the failure analysis and characterization of semiconductor devices and industry trends and solutions for advanced package development. In addition, ZEISS and partner solutions for die-level failure analysis and electrical characterization will be presented. They will include a live demonstration of the Kleindiek nano probing solutions and capabilities on a ZEISS GeminiSEM.​

​Who should attend this webinar:​
Failure Analysts, Product development, Yield Engineering engineers and managers at wafer foundries, fabless semiconductor companies, IDMs and service labs

The application of Bruker elemental analysis and Kleindiek nano-probing in ZEISS FE-SEM
Dr Yeoh Lai Seng | Infineon

As semiconductor features continue to shrink, nano-probing becomes important in isolating tiny physical defects down to the transistor level. Furthermore, the elemental mapping technique is essential to characterize the properties of the defect. This presentation will discuss the principles and applications of the Kleindiek nano-probing tool and Bruker EDX tool attached to the ZEISS FE-SEM.

Failure analysis and process characterization overview for Advanced packaging
Dr Zhao Si Ping | A*STAR Institute of Microelectronics

In this talk, Si Ping will briefly overview the current advanced packaging developments, the dynamics and exciting Moore than More trajectory. She will then share her views on process issues and defects, which could lead to yield loss and reliability concerns and the early detection and failure analysis challenges. Finally, she will conclude her talk with a forward-looking, exploratory review on combination inline – offline solutions.

Die Level Failure Analysis for Advanced Semiconductor Devices
Dr Chuan Wei Chung | ZEISS

Semiconductor device scaling in 3D dimensions and introducing complex architectures and materials have made failure analysis increasingly challenging. The workflow in the physical failure analysis involves multiple iterative steps with different tools and techniques starting from chip deprocessing with controlled layer by layer removal, inspection with light microscopes and SEM and defect localization with electrical characterization followed by defect characterization by FIB cross-section or TEM lamella preparation and analysis. In this presentation, we will present ZEISS solutions to address the challenges faced in these process steps to improve the throughput and success rate in the FA.

Kleindiek Live Virtual demo & Virtual Round table
Andreas Rummel & Dr Andrew Jonathan Smith | Kleindiek

Nanoprobing on current and future technology nodes pose challenges due to the devices' electron beam sensitivity. However, the ProbeWorkstation and its centrepiece, the PS8e Prober Shuttle, provide operators with the required tools and workflows to address these devices with ease - even at very low acceleration voltages. This will be demonstrated live by performing transistor characterization and EBIC experiments.

At the end of this session, you would have several learning outcomes, including​

  • ​Methods and techniques for die-level failure analysis​
  • Trends in advance packaging and challenges​
  • ZEISS Light Microscopy and Electron Microscopy solutions for die-level analysis​
  • Nanoprobing at low electron beam acceleration voltages

Advanced Package Development and Failure Analysis

Day 2

Thursday, 21st October 2021

2 PM - 5 PM SGT

The final day of the Electronics Week series focuses on ZEISS and partner solutions for the advanced packaging industry. Non-destructive imaging with an industry-leading X-Ray microscopy platform and developments in advanced machine learning to enhance image quality and high throughput will be presented. The importance of microstructural and material characterization and analysis of semiconductor die and electronic packages will be presented by Oxford Instruments. The final event will present the ZEISS Crossbeam laser applications in failure analysis and development of electronic packages with a live demo on the Crossbeam laser. ​

Who should attend this webinar:​
Failure analysts and engineers, R&D and Product Development Engineers, Technology Development Managers at fabless design houses, foundries, service labs, and IDMs

Applications of Ultra-high Resolution 3D X-ray Microscopy on Advanced Packaging
Dr Kai-Ti Hsu | MA-Tek

Materials Analysis Technology Inc. (MA-tek) is a world-class laboratory providing services in materials analysis (MA), Failure Analysis (FA) and Reliability Testing (RT) services. We currently have 13 laboratories around the world and providing various technical services. MA-Tek has rich, extensive experience in the analysis field, with 3D OM, 3D X-ray, grinding, delayering, SEM, TEM, EDX, SCM, SIMS and other technologies. In this presentation, we will provide some applications of ultra-high-resolution 3D-X-Ray and other related analysis examples on advanced packaging.

EDS-EBSD analysis for semiconductor die and package
Dr Wu Jiang  | Oxford Instruments

EDS and EBSD are important characterization tools that can qualify what elements are present within semiconductor chips, analyze microstructures of semiconductor devices, and detect local defects within samples. These are important information for understanding failures of semiconductor devices. In this presentation, several example case studies are provided, highlighting the power of the latest EBSD and EDS systems to solve key microstructural problems in the electronics industry. First, we present the microstructure characterization of 3D NAND Flash and transistor using the windowless EDS detector. In these cases, two analytical modes, the low kV EDS and STEM analysis, are introduced, which can achieve high-quality elemental maps with a spatial resolution better than 10nm. Second, the technique of identifying unknown compounds commonly formed at the jointing interface is discussed. This application is based on the EDS and EBSD integration system. Finally, we demonstrate compound identification and microstructure analysis workflow using the EBSD technique on three typical semiconductor packages, Al/Cu wire bonding, solder ball, and through-silicon via.​

Improving Success Rates in Failure Analysis and Accelerating Next Generation Package Development Cycles with High-Resolution X-Ray Microscopy
Yanjing Yang | ZEISS

The developments in advanced packaging are driving the More-than-Moore era to improve system performance and increased functionality in integrated circuits. As a result, package developers and failure analysts are faced with complex package architectures, shrinking package interconnect pitches and system-on-chip (SOC) integration, which leads to larger package footprints. As a result, non-Destructive characterization at sub-micron resolution has become more than relevant in addressing the needs of semiconductor package FA. In addition, a workflow for 3D metrology of multiple repetitive parts with high repeatability and reproducibility is also now feasible that can accelerate package development and process optimization. This webinar will introduce the unique architecture and detection technology combined with advanced machine learning-based reconstruction in the Xradia Versa family of X-Ray microscopes, which have become industry standard tools for failure analysis and are being increasingly adopted to accelerate electronic package development.

Crossbeam Laser – The Packaging FIB​
Live Demonstration

Dr Vignesh Viswanathan, Dr Wang Zhiqiang, Dr Jiao Longan​ | ZEISS

The focused ion beam platforms with FS-laser attachment have ushered in a new era of sample preparation capabilities. The ZEISS Crossbeam laser enables several applications that are challenging with conventional Ga FIB and plasma FIB. In this demonstration, we will introduce the unique features of the ZEISS Crossbeam laser, the operating principles and demonstrate sample preparation on IC packages.

At the end of this session, you would have several learning outcomes, including​

  • ​High-resolution EDS analysis for nanostructures in semiconductor dies​
  • Analyses of unknown compounds in various semiconductor packages by EBSD​
  • Characterization of complex microstructures within semiconductor samples​
  • Application of 3D X-ray microscopy to failure analysis of integrated circuit packages​
  • Advantages of 3D X-Ray microscopy technology over conventional CT ​
  • How machine learning accelerates time to result and enhances image quality for FA ​
  • Technical highlights of a new "packaging FIB" for improvement of FA workflow

Speaker's Profiles

Dr Zhao Si Ping | A*STAR IME

Dr Zhao Si Ping currently is the head of Industry Development, A*STAR IME. Before this, she was the head of App & Business development APAC (Asia Pacific) at ZEISS SMT-PCS, also the director of ZEISS-A*STAR joint Center of Excellence. ​

Si Ping’s entire 20+ yrs career has been in the semiconductor; from the research institute of Microelectronics to equipment supplier KLA-Tencor and wafer fab GlobalFoundries. She has broad and profound knowledge/ experience in semiconductors from process modules, integration, yield enhancement, FA, inline inspection, quality assurance and overall fab operation. She has been in several managing/leading roles since 2005, as FA head of ex-GF Chartered semi., Head of YDD at GF Fab7, and head of GF-SG manufacturing quality. ​

She has more than 100 reviewed publications, 10+ trade secrets and 7 patents. Her expertise is highly recognized in semiconductor in Yield enhancement, inline and offline metrology etc. ​

She has received her PhD – Solid-State Electronics, University of Liverpool, UK, in 1994 as a fully sponsored scholar and holds an MBA from the University of Western Australia.

Dr Yeoh Lai-Seng | Infineon

Lai-Seng is an experienced semiconductor professional and is a Principal Engineer at Infineon. With 3 years in Lumileds, 6 years in Fairchild Semiconductor and over 11 years in Spansion, Cypress and Infineon, Lai Seng bring over 20 years of experience in failure analysis. In addition, he has authored 19 conference proceedings and 4 publications in peer-reviewed journals. He holds a PhD in Semiconductor Engineering from USM and multiple Masters in Microelectronics and Applied Sciences.

Dr Chuan Wei Chung | ZEISS

Dr Chuan Wei Chung is an Application Specialist for the Electron Microscopy with ZEISS Research Microscopy Solutions in Asia Pacific. He graduated from the University of Auckland, New Zealand. His research looked into the effect of severe plastic deformation through Equal Channel Angular Pressing (ECAP) on magnesium alloys' microstructures and mechanical properties. He has vast application experiences in X-ray microanalysis in SEMs and TEMs and EBSD and TKD characterizations in SEMs.

Andreas Rummel | Kleindiek

Andreas Rummel studied physics at the Eberhard-Karls-Universität in Tübingen, focusing on electron and force microscopy. In addition, he is working on applied research and development in electrical probing, sample preparation and manipulation at Kleindiek Nanotechnik.

Dr Andrew Jonathan Smith | Kleindiek

Dr Andrew Jonathan Smith studied chemistry at the Heinrich-Heine-Universität Düsseldorf. After specializing in electrochemistry, he moved into the field of nanotechnology, studying arrays of metallic nanowires. In July 2008, he joined Kleindiek Nanotechnik and is responsible for sales support and application development.

Dr Kai-Ti Hsu | MA-tek

Dr Hsu got his PhD from National Central University with Material Science Department. With ten years of experience in Material Analysis, Dr Hsu has contributed to over 10 journal papers, specialized in surface analysis, consultant and integrated service of reverse engineering and patent infringement litigation.

Dr Wu Jiang | Oxford Instruments

Dr Wu Jiang is a Senior Application Scientist of Oxford Instruments working in Singapore. He is responsible for the microanalysis products of EDS, EBSD and WDS in Southeast Asia. He has more than ten years of work experience in this field. He holds a doctoral degree in Materials Physics and Chemistry from Dalian University of Technology (China) and a co-joint doctoral degree in Materials Science from Metz University (France).

Yang Yanjing | ZEISS

Yanjing joined ZEISS in September 2018 as Regional Product and Application Sales Specialist, mainly in charge of the X-Ray Microscopies, and developed the workflow for semiconductor customers. She has more than 10 years of experience in physical/surface analysis in the semiconductor industry. She worked in GlobalFoundries Singapore and Samsung Austin Semiconductor before, focusing on both die-level and package level Failure Analysis. She graduated from Electrical & Electronics Engineering and Industry System Engineering at the National University of Singapore.

Dr Vignesh Viswanathan | ZEISS

Dr Vignesh Viswanathan is a Business Development Manager responsible for strategic marketing and application development of microscopy solutions for the Electronics sector across Asia Pacific. Before ZEISS, Vignesh was a Senior Product Development Engineer in Advanced Micro Devices. He graduated from the National University of Singapore with a PhD in developing a novel Photoemission Electron Microscope and advanced nanofabrication techniques.

Dr Wang Zhiqiang | ZEISS

Dr Wang Zhiqiang studied physics at Nanjing University and holds a PhD specialising in renewable energy harvesting. He continued with a post-doc in the field of energy storage materials. In Jan 2018, he joined ZEISS as an applications specialist and is Crossbeam expert in the ZEISS Microscopy Customer Center in Shanghai.

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