Metrology Extension for 3D X-ray Microscopes - Adding Measurement Accuracy to X-ray Microscopy

Thursday, 17th September 2020 | 7:30 - 8:30 am (IST) | 10:00 - 11:00 am (CST) China

To respond to customers’ needs within industrial markets and the increasing demands for reliable measurements with 3D X-ray microscopes beyond high-resolution imaging capabilities, ZEISS is bringing a Metrology Extension (MTX) option—a combination of hardware and software—for Xradia 620/520 Versa systems to the market.

The capabilities of our new product module include the specification of the tightest MPE (maximum permissible error) currently offered in markets of 3D X-ray instruments for dimensional metrology. The MTX option extends ZEISS world-class metrology offerings to the well-known, high-resolution imaging capabilities of ZEISS 3D X-ray microscopes.

Highlights of this webinar:

  • Combine high-resolution X-ray imaging with high-precision metrology capabilities.
  • Measure with an accuracy far beyond the limits of conventional X-ray CT metrology.
  • Use seamless accuracy verification in accordance with the VDI/VDE 2630-1.3 part 1.
  • Non-destructively inspect the design of a part’s complex internal and external features.
  • Reveal the smallest dimensions and measure them most accurately.

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